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| 型號： | MPC8271CVRTIEA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 6/61頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II 516-PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 400MHz |
| 電壓： | 1.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA |
| 供應(yīng)商設(shè)備封裝： | 516-FPBGA（27x27） |
| 包裝： | 托盤 |
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MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
14
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
This table describes thermal characteristics. See Table 2 for information on a given SoC’s package.
Discussions of each characteristic are provided in Section 4.1, “Estimation with Junction-to-Ambient
Thermal Resistance,” through Section 4.7, “References.” For the these discussions, PD =(VDD × IDD) +
PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4 MPC8280, MPC8275VR, MPC8275ZQ only.
Table 7. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board1
1 Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
—
Junction-to-case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
—
Junction-to-package top4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
—
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