參數(shù)資料
型號(hào)： MPC8308ZQADD
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 13/83頁(yè)
文件大?。?/td> 0K
描述： MPU POWERQUICC II PRO 473MAPBGA
標(biāo)準(zhǔn)包裝： 84
系列： MPC83xx
處理器類(lèi)型： 32-位 MPC83xx PowerQUICC II Pro
速度： 266MHz
電壓： 1V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 473-LFBGA
供應(yīng)商設(shè)備封裝： 473-MAPBGA（19x19）
包裝： 托盤(pán)
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
20
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
This figure shows the RGMII AC timing and multiplexing diagrams.
Figure 11. RGMII AC Timing and Multiplexing Diagrams
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for MII
GTX_CLK125 reference clock period
tG12
6
—8.0
—
ns
GTX_CLK125 reference clock duty cycle
tG125H/tG125
47
—
53
%
Notes:
1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII timing.
For example, the subscript of tRGT represents the RGMII receive (RX) clock. Note also that the notation for rise (R) and fall
(F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew (SK)
followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is
added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
5. Duty cycle reference is 0.5*LVDD
6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
Table 25. RGMII AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 2.5 V ± 5%.
GTX_CLK
tRGT
tRGTH
tSKRGT
TX_CTL
TXD[8:5]
TXD[7:4]
TXD[9]
TXERR
TXD[4]
TXEN
TXD[3:0]
(At Transmitter)
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CLK
(At PHY)
RX_CTL
RXD[8:5]
RXD[7:4]
RXD[9]
RXERR
RXD[4]
RXDV
RXD[3:0]
RXD[8:5][3:0]
RXD[7:4][3:0]
RX_CLK
(At PHY)
tSKRGT
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MPC8308ZQADDA 功能描述:微處理器 - MPU E300 MP Pb 266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQAFD 功能描述:微處理器 - MPU E300 MP Pb 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQAFDA 功能描述:微處理器 - MPU E300 MP Pb 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQAGD 功能描述:微處理器 - MPU E300 MP Pb 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQAGDA 功能描述:微處理器 - MPU E300 MP Pb 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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