參數(shù)資料
型號： MPC8313ZQAGD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
封裝： 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
文件頁數(shù)： 48/100頁
文件大小： 1247K
代理商： MPC8313ZQAGD
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
51
JTAG
12 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std 1149.1 (JTAG)
interface.
12.1
JTAG DC Electrical Characteristics
Table 47 provides the DC electrical characteristics for the IEEE Std 1149.1 (JTAG) interface.
12.2
JTAG AC Timing Specifications
This section describes the AC electrical specifications for the IEEE Std 1149.1 (JTAG) interface.
Table 48 provides the JTAG AC timing specifications as defined in Figure 41 through Figure 45.
Table 47. JTAG Interface DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—2.1
NVDD +0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
——
±5
μA
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Table 48. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)1
At recommended operating conditions (see Table 2).
Parameter
Symbol2
Min
Max
Unit
Notes
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
JTAG external clock cycle time
t JTG
30
—
ns
JTAG external clock pulse width measured at 1.4 V
tJTKHKL
15
—
ns
JTAG external clock rise and fall times
tJTGR & tJTGF
02
ns
TRST assert time
tTRST
25
—
ns
3
Input setup times:
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
—
ns
4
Input hold times:
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
10
—
ns
4
Valid times:
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
2
11
ns
5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8313ZQAGDC 功能描述:微處理器 - MPU 8313 REV2.2 PB NO ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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