參數(shù)資料
型號(hào)： MPC8360ECVVAGDGA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 22/102頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
26
Freescale Semiconductor
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
Physical Layer Device Specification Version 1.2a (9/22/2000). The electrical characteristics for the MDIO and MDC are
8.1.1
10/100/1000 Ethernet DC Electrical Characteristics
The electrical characteristics specified here apply to media independent interface (MII), reduced gigabit media independent
interface (RGMII), reduced ten-bit interface (RTBI), reduced media independent interface (RMII) signals, management data
input/output (MDIO) and management data clock (MDC).
The MII and RMII interfaces are defined for 3.3 V, while the RGMII and RTBI interfaces can be operated at 2.5 V. The RGMII
and RTBI interfaces follow the Reduced Gigabit Media-Independent Interface (RGMII) Specification Version 1.3. The RMII
interface follows the RMII Consortium RMII Specification Version 1.2.
8.2
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
GMII Timing Specifications
This sections describe the GMII transmit and receive AC timing specifications.
Table 25. RGMII/RTBI, GMII, TBI, MII, and RMII DC Electrical Characteristics (when operating at 3.3 V)
Parameter
Symbol
Conditions
Min
Max
Unit
Notes
Supply voltage 3.3 V
LVDD
—
2.97
3.63
V
Output high voltage
VOH
IOH = –4.0 mA
LVDD = Min
2.40
LVDD + 0.3
V
—
Output low voltage
VOL
IOL = 4.0 mA
LVDD = Min
GND
0.50
V
—
Input high voltage
VIH
——
2.0
LVDD + 0.3
V
—
Input low voltage
VIL
—
–0.3
0.90
V
—
Input current
IIN
0 V
≤VIN ≤LVDD
—±10
μA—
Note:
1. GMII/MII pins that are not needed for RGMII, RMII, or RTBI operation are powered by the OVDD supply.
Table 26. RGMII/RTBI DC Electrical Characteristics (when operating at 2.5 V)
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LVDD
—
2.37
2.63
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.00
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
GND – 0.3
0.40
V
Input high voltage
VIH
—LVDD = Min
1.7
LVDD + 0.3
V
Input low voltage
VIL
—LVDD = Min
–0.3
0.70
V
Input current
IIN
0 V
≤VIN ≤LVDD
—±10
μA
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECVVAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAJDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAJDGA 功能描述:微處理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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