參數(shù)資料
型號(hào)： MPC8360ECVVAGDGA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 80/102頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
79
Pinout Listings
No Connect
NC
AM16, AM17, AM20, AN13, AN16, AN17, AP10,
AP11, AP13, AP15, AP18, AR11, AR13, AR14,
AR15, AR16, AR17, AR20, AT11, AT12, AT13,
AT14, AT16, AT17, AT18, AU10, AU11, AU12,
AU13, AU15, AU19
——
—
Notes:
1. This pin is an open drain signal. A weak pull-up resistor (1 k
Ω) should be placed on this pin to OVDD.
2. This pin is an open drain signal. A weak pull-up resistor (2–10 k
Ω) should be placed on this pin to OVDD.
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation.
6. These are On Die Termination pins, used to control DDR2 memories internal termination resistance.
7. This pin must always be tied to GND.
8. This pin must always be left not connected.
9. Refer to MPC8360E PowerQUICC II Pro Integrated Communications Processor Reference Manual section on “RGMII Pins,”
for information about the two UCC2 Ethernet interface options.
10.This pin must always be tied to GVDD.
11.It is recommended that MDIC0 be tied to GND using an 18.2
Ω resistor and MDIC1 be tied to DDR power using an 18.2 Ω
resistor for DDR2.
Table 67. MPC8358E TBGA Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECVVAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAJDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAJDGA 功能描述:微處理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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