參數(shù)資料
型號(hào)： MPC8360ECZUAGDGA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 12/102頁(yè)
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
17
RESET AC Electrical Characteristics
5.2
RESET AC Electrical Characteristics
This section describes the AC electrical specifications for the reset initialization timing requirements of the device. This table
provides the reset initialization AC timing specifications for the DDR SDRAM component(s).
This table provides the PLL and DLL lock times.
Table 11. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET or SRESET (input) to activate reset
flow
32
—
tPCI_SYNC_IN
Required assertion time of PORESET with stable clock applied to CLKIN
when the device is in PCI host mode
32
—
tCLKIN
Required assertion time of PORESET with stable clock applied to
PCI_SYNC_IN when the device is in PCI agent mode
32
—
tPCI_SYNC_IN
HRESET/SRESET assertion (output)
512
—
tPCI_SYNC_IN
HRESET negation to SRESET negation (output)
16
—
tPCI_SYNC_IN
Input setup time for POR config signals (CFG_RESET_SOURCE[0:2] and
CFG_CLKIN_DIV) with respect to negation of PORESET when the device
is in PCI host mode
4—
tCLKIN
Input setup time for POR config signals (CFG_RESET_SOURCE[0:2] and
CFG_CLKIN_DIV) with respect to negation of PORESET when the device
is in PCI agent mode
4—
tPCI_SYNC_IN
Input hold time for POR config signals with respect to negation of HRESET
0—
ns
—
Time for the device to turn off POR config signals with respect to the
assertion of HRESET
—4
ns
Time for the device to turn on POR config signals with respect to the
negation of HRESET
1—
tPCI_SYNC_IN
1, 3
Notes:
1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. When the device is In PCI host mode the
primary clock is applied to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. Refer
MPC8360E PowerQUICC II Pro Integrated Communications Processor Reference Manual for more details.
2. tCLKIN is the clock period of the input clock applied to CLKIN. It is only valid when the device is in PCI host mode. Refer
MPC8360E PowerQUICC II Pro Integrated Communications Processor Reference Manual for more details.
3. POR config signals consists of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV.
Table 12. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
—
100
μs—
DLL lock times
7680
122,880
csb_clk cycles
Notes:
1. DLL lock times are a function of the ratio between the output clock and the coherency system bus clock (csb_clk). A 2:1
ratio results in the minimum and an 8:1 ratio results in the maximum.
2. The csb_clk is determined by the CLKIN and system PLL ratio. See Section 21, “Clocking,” for more information.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECZUAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAJDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECZUAJDGA 功能描述:微處理器 - MPU 8360 TBGA C ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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