參數(shù)資料
型號(hào)： MPC8360ZUAGDG
廠商： Freescale Semiconductor
文件頁數(shù)： 98/102頁
文件大?。?/td> 0K
描述： IC MPU PWRQUICC II 740-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
95
Heat Sink Attachment
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
22.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a
spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board,
or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board.
Such peeling forces reduce the solder joint lifetime of the package. Recommended maximum force on the top of the package is
10 lb force (4.5 kg force). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or
plastic surfaces and its performance verified under the application requirements.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ZUAGDGA 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAHFH 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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