參數(shù)資料
型號(hào)： MPC8378CVRAGD
廠商： Freescale Semiconductor
文件頁數(shù)： 25/128頁
文件大?。?/td> 0K
描述： MPU POWERQUICC II PRO 689-PBGA
標(biāo)準(zhǔn)包裝： 27
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 689-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 689-TEPBGA II（31x31）
包裝： 托盤
MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
120
Freescale Semiconductor
Tyco Electronics
Chip Coolers
www.chipcoolers.com
Wakefield Engineering
www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
www.dowcorning.com
Shin-Etsu MicroSi, Inc.
www.microsi.com
The Bergquist Company
www.bergquistcompany.com
23.3
Heat Sink Attachment
The device requires the use of heat sinks. When heat sinks are attached, an interface material is required,
preferably thermal grease and a spring clip. The spring clip should connect to the printed circuit board,
either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces
that can lift the edge of the package or peel the package from the board. Such peeling forces reduce the
solder joint lifetime of the package. The recommended maximum compressive force on the top of the
package is 10 lb force (4.5 kg force). Any adhesive attachment should attach to painted or plastic surfaces,
and its performance should be verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8378CVRAGDA 功能描述:微處理器 - MPU 8378 PBGA XT PbFr No ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8378CVRAGFA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378CVRAGGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378CVRAJDA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378CVRAJF 功能描述:微處理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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