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| 型號(hào)： | MPC8378EVRAGDA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA689 |
| 封裝： | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689 |
| 文件頁(yè)數(shù)： | 17/125頁(yè) |
| 文件大?。?/td> | 894K |
| 代理商： | MPC8378EVRAGDA |
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MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
113
23
Thermal
This section describes the thermal specifications of the MPC8378E.
23.1
Thermal Characteristics
This table provides the package thermal characteristics for the 689 31
31mm TePBGA II package.
23.2
Thermal Management Information
For the following sections, PD = (VDD IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
23.2.1
Estimation of Junction Temperature with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TJ = junction temperature (C)
TA = ambient temperature for the package (C)
RJA = junction to ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
Table 77. Package Thermal Characteristics for TePBGA II
Parameter
Symbol
Value
Unit
Note
Junction-to-ambient natural convection on single layer board (1s)
RJA
21
C/W
Junction-to-ambient natural convection on four layer board (2s2p)
RJA
15
C/W
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
RJMA
16
C/W
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
RJMA
12
C/W
Junction-to-board thermal
RJB
8
C/W
Junction-to-case thermal
RJC
6
C/W
Junction-to-package natural convection on top
JT
6
C/W
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8378EVRAGFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378EVRAGGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378EVRAJDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378EVRAJF | 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8378EVRAJFA | 功能描述:微處理器 - MPU 8378 PBGA ST PbFr W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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