參數(shù)資料
型號: MPC8378VRANDA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA689
封裝: 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
文件頁數(shù): 113/125頁
文件大小: 894K
代理商: MPC8378VRANDA
MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
88
21
Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
21.1
Package Parameters for the MPC8378E TePBGA II
The package parameters are provided in the following list. The package type is 31 mm
31 mm, 689 plastic ball grid array
(TePBGA II).
Package outline
31 mm
31 mm
Interconnects
689
Pitch
1.00 mm
Module height (typical)
2.0 mm to 2.46 mm (maximum)
Solder Balls
3.5% Ag, 96.5% Sn
Ball diameter (typical)
0.60 mm
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