參數資料
型號: MPC8379ECVRAGDA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA689
封裝: 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
文件頁數: 5/114頁
文件大小: 1337K
代理商: MPC8379ECVRAGDA
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
102
Freescale Semiconductor
Thermal
23 Thermal
This section describes the thermal specifications of the MPC8379E.
23.1
Thermal Characteristics
Table 77 provides the package thermal characteristics for the 689 31
× 31mm TePBGA II package.
48.0
0
1
2
3
576
144
288
72 6
36
18
360
432
66.7
0
1
2
533
133
266
66.7
33.3
16.7
333
400
25.0
0
4
8
800
200
100 6
50
25
400
500
600
33.3
0
2
8
533
266.7
267
133 6
66.7
33.3
400
533
667
800
50.0
0
4
800
200
100 6
50
25
400
500
600
50.0
0
2
8
800
400
400 5
100 6
50
600
800
66.7
0
2
4
533
266.7
267
133 6
66.7
33.3
400
533
667
800
66.7
0
2
5
667
333
83.3 6 41.6
333
500
667
66.7
0
2
6
800
400
400 5
100 6
50
400
600
800
Note:
1 Values in MHz.
2 System PLL VCO range: 400–800 MHz.
3 CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates.
4 Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz.
5 Applies to DDR2 only.
6 Applies to eLBC PLL-enabled mode only.
Table 77. Package Thermal Characteristics for TePBGA II
Parameter
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient natural convection on four layer board (2s2p)
RθJA
15
°C/W
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
RθJMA
16
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
RθJMA
12
°C/W
1, 3
Junction-to-board thermal
RθJB
8
°C/W
Junction-to-case thermal
RθJC
6
°C/W
Table 76. Example Clock Frequency Combinations (continued)
eLBC
1
e300 Core
1
Ref
1
LBCM DDRCM SVCOD SPMF
Sys
VCO1,2
CSB
1,3 DDR data
rate1,4
/2
/4
/8
× 1 × 1.5 × 2 × 2.5 × 3
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