參數(shù)資料
型號: MPC852TCVR100A
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
封裝: PLASTIC, BGA-256
文件頁數(shù): 2/80頁
文件大小: 998K
代理商: MPC852TCVR100A
MPC852T PowerQUICC Hardware Specifications, Rev. 4
10
Freescale Semiconductor
Thermal Calculation and Measurement
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device-related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around
the device, add a heat sink, change the mounting arrangement on the printed-circuit board, or change the
thermal dissipation on the printed-circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed-circuit board. Thermal performance of most plastic packages and
especially PBGA packages is strongly dependent on the board temperature. If the board temperature is
known, an estimate of the junction temperature in the environment can be made using the following
equation:
TJ = TB +(RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (C/W)
TB = board temperature (C)
PD = power dissipation in package
相關(guān)PDF資料
PDF描述
MPC852TCZT100A 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
MPC852TCVR80A 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256
MPC852TCZT50A 32-BIT, 50 MHz, RISC PROCESSOR, PBGA256
MPC852TZT100A 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
MPC852TCVR50A 32-BIT, 50 MHz, RISC PROCESSOR, PBGA256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC852TCVR50A 功能描述:微處理器 - MPU Ethernet 50 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TCVR50A 制造商:Freescale Semiconductor 功能描述:Embedded Networking Processor
MPC852TCVR66A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TCVR80A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TCZT100A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324