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參數(shù)資料
| 型號： | MPC852TCVR100A |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 |
| 封裝： | PLASTIC, BGA-256 |
| 文件頁數(shù)： | 67/80頁 |
| 文件大小： | 998K |
| 代理商： | MPC852TCVR100A |
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MPC852T PowerQUICC Hardware Specifications, Rev. 4
Freescale Semiconductor
7
Thermal Characteristics
This device contains circuitry protecting against damage that high-static voltage or electrical fields cause;
however, Freescale recommends taking normal precautions to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate logic voltage level (for example, either GND or VDD).
4
Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC852T.
Table 2. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature 1 (standard)
1 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum temperatures are guaranteed as junction
temperature, Tj.
TA(min)
0°C
Tj(max)
95
°C
Temperature (extended)
TA(min)
– 40
°C
Tj(max)
100
°C
Table 3. MPC852T Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal
49
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal
32
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
41
Four-layer board (2s2p)
RθJMA
3
29
Junction-to-board4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
24
Junction-to-case5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
RθJC
13
Junction-to-package top6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2
Natural convection
ΨJT
3
Airflow (200 ft/min)
ΨJT
2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC852TCVR50A | 功能描述:微處理器 - MPU Ethernet 50 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC852TCVR50A | 制造商:Freescale Semiconductor 功能描述:Embedded Networking Processor |
| MPC852TCVR66A | 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC852TCVR80A | 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC852TCZT100A | 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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