參數(shù)資料
型號(hào)： MPC852TVR80
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Hardware Specifications
中文描述： 硬件規(guī)格
文件頁數(shù)： 6/80頁
文件大?。?/td> 3080K
代理商： MPC852TVR80
MPC852T Hardware Specifications, Rev. 3.1
6
Freescale Semiconductor
Power Dissipation
5
Power Dissipation
Table 4
provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice bus speed.
Table 3. MPC852T Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal
3
Per JEDEC JESD51-6 with the board horizontal
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to
case thermal resistance is a simulated value from the junction to the exposed pad without contact
resistance.
6
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2
Natural convection
Single layer board (1s)
R
θ
JA 2
R
θ
JMA 3
R
θ
JMA3
R
θ
JMA3
49
°C/W
Four layer board (2s2p)
32
Air flow (200 ft/min)
Single layer board (1s)
41
Four layer board (2s2p)
29
Junction to board
4
R
θ
JB
24
Junction to case
5
R
θ
JC
13
Junction to package top
6
Natural convection
Ψ
JT
3
Air flow (200 ft/min)
Ψ
JT
2
Table 4. Power Dissipation (P
D
)
Die Revision
Bus Mode
Frequency
(MHz)
Typical
1
1
Typical power dissipation is measured at 1.9 V.
Maximum
2
Unit
0
1:1
50
110
140
mW
66
150
180
mW
2:1
66
140
160
mW
80
170
200
mW
100
210
250
mW
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MPC852TZT66A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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