參數(shù)資料
型號(hào): MPC8560PX833LB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-783
文件頁(yè)數(shù): 3/104頁(yè)
文件大?。?/td> 1244K
代理商: MPC8560PX833LB
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
100
Freescale Semiconductor
Document Revision History
3.3
Updated MVREF Max Value in Table 1.
Removed Figure 3.
In Table 4, replaced TBD with power numbers and added footnote.
Updated specs and footnotes in Table 8.
Corrected max number for MVREF in Table 13.
Changed parameter “Clock cycle duration” to “Clock period” in Table 27.
Added note 4 to tLBKHOV1 and removed LALE reference from tLBKHOV3 in Table 31 and Table 32.
Updated LALE signal in Figure 17 and Figure 18.
Modified Figure 21.
Modified Figure 61.
3.2
Updated Table 1 and Table 2 with 1.0 GHz device parameter requirements.
Added CPM port signal drive strength to Table 3.
Updated Table 4 with Maximum power data.
Updated Table 4 and Table 5 with 1 GHz speed grade information.
Updated Table 6 with corrected typical I/O power numbers.
Updated Table 7 Note 2 lower voltage measurement point.
Replaced Table 7 Note 5 with spread spectrum clocking guidelines.
Added to Table 8 rise and fall time information.
Removed VIL and VIH references from Table 21, Table 22, Table 23, and Table 24.
Updated tTTKHDX value in Table 25.
Updated PMA_RX_CLK references to RX_CLK in Section 7.2.3.2, “TBI Receive AC Timing
Updated Table 27 Note 2.
Corrected Table 29 fMDC and tMDC to reflect the correct minimum operating frequency.
Updated Table 29 tMDKHDV and tMDKHDX values for clarification.
Added tLBKHKT and updated Note 2 in Table 32.
Corrected LGTA timing references in Figure 17.
Corrected FCC output timing reference labels in Figure 24 and Figure 25.
Updated Figure 50.
Clarified Table 54 Note 5.
Updated Table 55 and Table 56 with 1 GHz information.
Added heat sink removal discussion to Section 16.2.3, “Thermal Interface Materials”.
Corrected and added 1 GHz part number to Table 62.
3.1
Updated Table 4 and Table 5.
Added Table 6.
Added MCK duty cycle to Table 16.
Updated fMDC, tMDC, tMDKHDV, and tMDKHDX parameters in Table 29.
Added LALE to tLBKHOV3 parameter in Table 31 and Table 32, and updated Figure 17.
Corrected active level designations of some of the pins in Table 54.
Updated Table 62.
Table 63. Document Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560PX833LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFB 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFC 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324