參數(shù)資料
型號(hào): MPC8560PX833LB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-783
文件頁數(shù): 97/104頁
文件大小: 1244K
代理商: MPC8560PX833LB
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
92
Freescale Semiconductor
System Design Information
Figure 58 shows the PLL power supply filter circuit.
Figure 58. PLL Power Supply Filter Circuit
17.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8560 system, and the device
itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system
designer place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pins of the device.
These decoupling capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and
GND power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed
directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
quick response time necessary. They should also be connected to the power and ground planes through two
vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo
OSCON).
17.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high
inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of
the device.
17.5
Output Buffer DC Impedance
The MPC8560 drivers are characterized over process, voltage, and temperature. There are two driver
types: a push-pull single-ended driver (open drain for I2C) for all buses except RapidIO, and a
current-steering differential driver for the RapidIO port.
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 59). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
VDD
AVDD (or L2AVDD)
2.2 F
GND
Low ESL Surface Mount Capacitors
10
Ω
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