參數(shù)資料
型號(hào)： MPC8560PXAPFB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 6/108頁
文件大小： 2170K
代理商： MPC8560PXAPFB
MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1
Freescale Semiconductor
103
Document Revision History
2.0
Section 1.1—Updated features list to coincide with latest version of the reference manual
Table 1 and Table 2— Addition of CPM to OVDD and OVIN; Addition of SYSCLK to OVIN
Table 2—Addition of notes 1 and 2
Table 3—Addition of note 1
Section 4—New
Table 12—Addition of IVREF
Table 14—Modified maximum values for tDISKEW
Table 15—Added MSYNC_OUT to tMCKSKEW2
Section 6.2.1—Removed Figure 4, "DDR SDRAM Input Timing Diagram"
Section 7.1—Removed refereneces to 2.5 V from first paragraph
Table 18 and Table 19—Modified “conditions” for IIH and I IL
Table 20—Addition of min and max for GTX_CLK125 reference clock duty cycle
Table 24—Addition of min and max for GTX_CLK125 reference clock duty cycle
Table 26—Addition of min and max for GTX_CLK125 reference clock duty cycle
Figure 17 and Figure 19—Changed LSYNC_IN to Internal clock at top of each figure
Table 33—Modified values for tFIIVKH, tNIIVKH, and tTDIVKH; addition of tPIIVKH and tPIIXKH.
Table 34—Modified values for tFEKHOX, tNIKHOX,tNEKHOX, tTDKHOX; addition of tPIKHOX.
Figure 23—New
Figure 30—New
Figure 36—New
Figure 38—New
Table 30—Removed row for tLBKHOX3
Table 43—New (AC timing of PCI-X at 66 MHz)
Table 53—Addition of note 19
Figure 60—Addition of jumper and note at top of diagram
Table 55—Changed max bus freq for 667 core to 166
Section 16.2.1—Modified first paragraph
Figure 52—Modified
Figure 53—New
Table 59—Modified thermal resistance data
Section 16.2.4.2—Modified first and second paragraphs
2.1
Section 2.1.2—New
Table 15—Added speed-specifc minimum values for 333, 266, and 200 MHz
Table 30—Replaced all refereneces to TSEC1_TXD[6:5] to TSEC2_TXD[6:5]
Table 30—Added tLBSKEW and note 3
Table 30—Added comment about rev. 2.x devices to note 5
Section 14.1— Changed minium height from 2.22 to 3.07 and maximum from 2.76 to 3.75
Section 16.2.4.1—Changed
θ
JC from 0.3 to 0.8; changed die-junction temperature from 67° to 71°
Section 17.7—Added paragraph that begins “TSEC1_TXD[3:0]...”
Table 61. Document Revision History
Rev. No.
Substantive Change(s)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560PXAQFB 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFC 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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