參數(shù)資料
型號: MPC8572VTAVNB
廠商: Freescale Semiconductor
文件頁數(shù): 66/138頁
文件大小: 0K
描述: MPU POWERQUICC III 1023-PBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.5GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
33
Ethernet: Enhanced Three-Speed Ethernet (eTSEC)
Figure 9 shows the GMII transmit AC timing diagram.
Figure 9. GMII Transmit AC Timing Diagram
8.2.2.2
GMII Receive AC Timing Specifications
Table 28 provides the GMII receive AC timing specifications.
Figure 10 provides the AC test load for eTSEC.
Figure 10. eTSEC AC Test Load
Table 28. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0—
ns
RX_CLK clock rise (20%-80%)
tGRXR
2
——
1.0
ns
RX_CLK clock fall time (80%-20%)
tGRXF
2
——
1.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII
receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock
reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to
the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
tGTKHDV
TX_EN
TX_ER
Output
LVDD/2
RL = 50 Ω
Z0 = 50 Ω
相關(guān)PDF資料
PDF描述
MPC8572VTAULB MPU POWERQUICC III 1023-PBGA
MPC8572VTATLB MPU POWERQUICC III 1023-PBGA
MPC8572VTARLD MPU POWERQUICC III 1023-PBGA
CAT24C05WI-G IC EEPROM SERIAL 4KB I2C 8SOIC
MPC8572VTARLB MPU POWERQUICC III 1023-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572VTAVND 功能描述:微處理器 - MPU 32-BIT CMOS 1.5GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572VTAVNE 功能描述:微處理器 - MPU 38H R211 NoE NoPb 1500 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857DSLCVR66B 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857DSLCZQ66B 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857DSLVR50B 功能描述:微處理器 - MPU POWER QUICC - NO PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324