參數(shù)資料
型號: MPC859
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Hardware Specifications
中文描述: 硬件規(guī)格
文件頁數(shù): 59/92頁
文件大小: 1274K
代理商: MPC859
MOTOROLA
MPC866/859 Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
59
CPM Electrical Characteristics
12.7
SCC in NMSI Mode Electrical Specifications
Table 22 shows the NMSI external clock timings.
Table 23 shows the NMSI internal clock timings.
Table 22. NMSI External Clock Timings
Num
Characteristic
All Frequencies
Unit
Min
Max
100
RCLK1 and TCLK1 width high
1
1
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2.25/1.
2
Also applies to CD and CTS hold time when they are used as an external sync signal.
1/SYNCCLK
ns
101
RCLK1 and TCLK1 width low
1/SYNCCLK +5
ns
102
RCLK1 and TCLK1 rise/fall time
15.00
ns
103
TXD1 active delay (from TCLK1 falling edge)
0.00
50.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
50.00
ns
105
CTS1 setup time to TCLK1 rising edge
5.00
ns
106
RXD1 setup time to RCLK1 rising edge
5.00
ns
107
RXD1 hold time from RCLK1 rising edge
2
5.00
ns
108
CD1 setup time to RCLK1 rising edge
5.00
ns
Table 23. NMSI Internal Clock Timings
Num
Characteristic
All Frequencies
Unit
Min
Max
100
RCLK1 and TCLK1 frequency
1
1
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 3/1.
2
Also applies to CD and CTS hold time when they are used as an external sync signals.
0.00
SYNCCLK/3
MHz
102
RCLK1 and TCLK1 rise/fall time
ns
103
TXD1 active delay (from TCLK1 falling edge)
0.00
30.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
30.00
ns
105
CTS1 setup time to TCLK1 rising edge
40.00
ns
106
RXD1 setup time to RCLK1 rising edge
40.00
ns
107
RXD1 hold time from RCLK1 rising edge
2
0.00
ns
108
CD1 setup time to RCLK1 rising edge
40.00
ns
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料
PDF描述
MPC859DSLZP66 Circular Connector; No. of Contacts:55; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:22-55
MPC859PZP133 Hardware Specifications
MPC859DSL Hardware Specifications
MPC859T Hardware Specifications
MPC859DSLZP50 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:3; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC859DSLCVR50A 功能描述:微處理器 - MPU 50 MHz 66 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859DSLCVR66A 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859DSLCZP50A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859DSLCZP66A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859DSLVR50A 功能描述:微處理器 - MPU 50 MHz 66 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324