參數(shù)資料
型號(hào): MPC859DSLCVR66A
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 89/96頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC 66MHZ 357PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC8xx
處理器類(lèi)型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 1.8V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤(pán)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
9
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC866/859.
Table 4. MPC866/859 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient 1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Natural Convection
Single-layer board (1s)
RθJA
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
37
°C/W
Four-layer board (2s2p)
RθJMA
3
Per JEDEC JESD51-6 with the board horizontal.
23
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
30
Four-layer board (2s2p)
RθJMA
19
Junction-to-board 4
4
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
13
Junction-to-case 5
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
RθJC
6
Junction-to-package top 6
6
Thermal characterization parameter indicating the temperature difference between package top and junction
temperature per JEDEC JESD51-2.
Natural Convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
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