參數(shù)資料
型號(hào)： MPC859PZP100
廠(chǎng)商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類(lèi)： 圓形連接器
英文描述： Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:61; Connector Shell Size:24; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:24-61
中文描述： 硬件規(guī)格
文件頁(yè)數(shù)： 19/92頁(yè)
文件大?。?/td> 1274K
代理商： MPC859PZP100
MOTOROLA
MPC866/859 Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
19
Bus Signal Timing
B24a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 0
(MIN = 0.50 x B1 - 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B25
CLKOUT rising edge to OE, WE(0:3)
asserted (MAX = 0.00 x B1 + 9.00)
—
9.00
—
9.00
—
9.00
—
9.00
ns
B26
CLKOUT rising edge to OE negated
(MAX = 0.00 x B1 + 9.00)
2.00
9.00
2.00
9.00
2.00
9.00
2.00
9.00
ns
B27
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25 x B1 - 2.00)
35.90
—
29.30
—
23.00
—
16.90
—
ns
B27a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50 x B1 - 2.00)
43.50
—
35.50
—
28.00
—
20.70
—
ns
B28
CLKOUT rising edge to WE(0:3)
negated GPCM write access CSNT =
0 (MAX = 0.00 x B1 + 9.00)
—
9.00
—
9.00
—
9.00
—
9.00
ns
B28a CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0,1, CSNT = 1, EBDF = 0 (MAX = 0.25
x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B28b CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
CSNT = 1, ACS = 10 or ACS = 11,
EBDF = 0 (MAX = 0.25 x B1 + 6.80)
—
14.30
—
13.00
—
11.80
—
10.50
ns
B28c CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0, CSNT = 1 write access TRLX = 0,1,
CSNT = 1, EBDF = 1 (MAX = 0.375 x
B1 + 6.6)
10.90
18.00
10.90
18.00
7.00
14.30
5.20
12.30
ns
B28d CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
CSNT = 1, ACS = 10, or ACS = 11,
EBDF = 1 (MAX = 0.375 x B1 + 6.6)
—
18.00
—
18.00
—
14.30
—
12.30
ns
B29
WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, CSNT = 0,
EBDF = 0 (MIN = 0.25 x B1 - 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B29a WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 0 (MIN = 0.50 x B1
– 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B29b CS negated to D(0:31), DP(0:3), High
Z GPCM write access, ACS = 00,
TRLX = 0,1 & CSNT = 0 (MIN = 0.25 x
B1– 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
Table 9. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
F
Freescale Semiconductor, Inc.
n
.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC859PZP100A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859PZP133A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TCVR100A 功能描述:微處理器 - MPU PQ I HIP6W NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TCZP100A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TVR100A 功能描述:微處理器 - MPU PQ I HIP6W NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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