參數(shù)資料
型號(hào)： MPC859PZP100
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類(lèi)： 圓形連接器
英文描述： Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:61; Connector Shell Size:24; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:24-61
中文描述： 硬件規(guī)格
文件頁(yè)數(shù)： 9/92頁(yè)
文件大?。?/td> 1274K
代理商： MPC859PZP100
MOTOROLA
MPC866/859 Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
9
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC866/859.
Table 4. MPC866/859 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and junction
temperature per JEDEC JESD51-2.
Natural Convection
Single-layer board (1s)
R
θ
JMA 3
JA 2
2
37
°C/W
Four-layer board (2s2p)
R
θ
3
23
Airflow (200 ft/min)
Single-layer board (1s)
R
θ
JMA3
30
Four-layer board (2s2p)
R
θ
JMA3
19
Junction-to-board
4
4
R
θ
JB
13
Junction-to-case
5
5
R
θ
JC
6
Junction-to-package top
6
6
Natural Convection
Ψ
JT
2
Airflow (200 ft/min)
Ψ
JT
2
F
Freescale Semiconductor, Inc.
n
.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC859PZP100A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859PZP133A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TCVR100A 功能描述:微處理器 - MPU PQ I HIP6W NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TCZP100A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TVR100A 功能描述:微處理器 - MPU PQ I HIP6W NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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