參數(shù)資料
型號(hào)： MPC885VR66
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 66 MHz, RISC PROCESSOR, PBGA357
封裝： LEAD FREE, PLASTIC, BGA-357
文件頁(yè)數(shù)： 2/87頁(yè)
文件大小： 1046K
代理商： MPC885VR66
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
10
Freescale Semiconductor
Thermal Characteristics
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or VDD).
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC885/MPC880.
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature1 (standard)
1 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum
temperatures are guaranteed as junction temperature, TJ.
TA(min)
0°C
TJ(max)
95
°C
Temperature (extended)
TA(min)
–40
°C
TJ(max)
100
°C
Table 4. MPC885/MPC880 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
37
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
25
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
30
Four-layer board (2s2p)
RθJMA
22
Junction-to-board4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
——
RθJB
17
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
——
RθJC
10
Junction-to-package top6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Natural convection
—
ΨJT
2
Airflow (200 ft/min)
—
ΨJT
2
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MPC-8890 制造商:AAEON 制造商全稱:AAEON 功能描述:Intel Pentium M or Celeron M Processors
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