參數(shù)資料
型號(hào): MSM63182-XXX
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC107
封裝: 4.44 X 4.92 MM, 0.35 MM HEIGHT, DIE-107
文件頁(yè)數(shù): 21/28頁(yè)
文件大?。?/td> 241K
代理商: MSM63182-XXX
Semiconductor
MSM63182
27/27
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP128-P-1420-0.50-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
1.19 TYP.
Mirror finish
相關(guān)PDF資料
PDF描述
MSM63188A-XXXGS-BK 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP176
MSM6351-(DIE)3V 4-BIT, MROM, 0.032768 MHz, MICROCONTROLLER
MSM6351-GS-K1.5V 4-BIT, MROM, 0.032768 MHz, MICROCONTROLLER, PQFP100
MSM6352-XXGS-K 4-BIT, MROM, 3.58 MHz, MICROCONTROLLER, PQFP44
MSM6408-GS-VIK 4-BIT, MROM, MICROCONTROLLER, PQFP44
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