參數(shù)資料
型號(hào): MSP430F2274MRHAEP
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, RISC MICROCONTROLLER, PQCC40
封裝: GREEN, PLASTIC, MO-220VJJD-2, VQFN-40
文件頁數(shù): 44/79頁
文件大?。?/td> 1274K
代理商: MSP430F2274MRHAEP
www.ti.com
SLAS614C – SEPTEMBER 2008 – REVISED JULY 2010
JTAG and Spy-Bi-Wire Interface – Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
–55°C to 125°C
2.2 V/3 V
0
20
MHz
0.02
tSBW,Low Spy-Bi-Wire low clock pulse length
–55°C to 125°C
2.2 V/3 V
15
ms
5
Spy-Bi-Wire enable time
tSBW,En
(TEST high to acceptance of first clock
–55°C to 125°C
2.2 V/3 V
1
ms
edge(1))
Spy-Bi-Wire return to normal operation
tSBW,Ret
–55°C to 125°C
2.2 V/3 V
15
100
ms
time
2.2 V
0
5
MHz
fTCK
TCK input frequency(2)
–55°C to 125°C
3 V
0
10
MHz
RInternal
Internal pulldown resistance on TEST
–55°C to 125°C
2.2 V/3 V
25
60
90
k
(1)
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before
applying the first SBWCLK clock edge.
(2)
fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse
(1) – Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
MAX
UNIT
VCC(FB)
Supply voltage during fuse-blow condition
TA = 25°C
2.5
V
VFB
Voltage level on TEST for fuse blow
–55°C to 125°C
6
7
V
IFB
Supply current into TEST during fuse blow
–55°C to 125°C
100
mA
tFB
Time to blow fuse
–55°C to 125°C
1
ms
(1)
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
Copyright 2008–2010, Texas Instruments Incorporated
49
Product Folder Link(s): MSP430F2274-EP
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