參數(shù)資料
型號: MSP430F5514IRGC
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQCC64
封裝: GREEN ,PLASTIC, VQFN-64
文件頁數(shù): 59/115頁
文件大?。?/td> 1159K
代理商: MSP430F5514IRGC
MSP430F551x
MSP430F552x
SLAS590D – OCTOBER 2009 – REVISED APRIL 2010
www.ti.com
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
–0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)(2)
–0.3 V to VCC + 0.3 V
Diode current at any device pin
±2 mA
Storage temperature range, Tstg
(3)
–55°C to 105°C
Maximum junction temperature, TJ
95°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
(3)
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER
VALUE
UNIT
QFP (PN)
70
Low-K board (JESD51-3)
QFN (RGC)
55
BGA (ZQE)
84
qJA
Junction-to-ambient thermal resistance, still air
°C/W
QFP (PN)
45
High-K board (JESD51-7)
QFN (RGC)
25
BGA (ZQE)
46
QFP (PN)
12
qJC
Junction-to-case thermal resistance
QFN (RGC)
12
°C/W
BGA (ZQE)
30
QFP (PN)
22
qJB
Junction-to-board thermal resistance
QFN (RGC)
6
°C/W
BGA (ZQE)
20
48
Copyright 2009–2010, Texas Instruments Incorporated
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