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參數(shù)資料
| 型號(hào)： | MT28C128564W18EBW-F605P706TBWT |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA77 |
| 封裝： | LEAD FREE, FBGA-77 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 203K |
| 代理商： | MT28C128564W18EBW-F605P706TBWT |
128Mb MULTIBANK BURST FLASH
32Mb/64Mb BURST CellularRAM COMBO
09005aef80df9a45
Micron Technology, Inc., reserves the right to change products or specifications without notice..
MT28C128564W18E.fm - Rev. C Pub 2/04 EN
14
2004 Micron Technology, Inc
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
All other trademarks are the property of their respective owners.
Figure 5: 77-Ball FBGA
NOTE:
1. All dimensions in millimeters.
Data Sheet Designation
Production: This data sheet contains minimum and maximum limits specified over the complete power supply
and temperature range for production devices. Although considered final, these specifications are subject to
change, as further product development and data characterization sometimes occur.
For additional documentation concerning Flash and CellularRAM features, functional descriptions, program-
ming, and timing, please refer to the table below.
BALL A1 ID
1.025 ±0.075
SEATING PLANE
0.10 C
C
1.40 MAX
BALL A8
BALL A1 ID
0.80
TYP
0.80 TYP
2.80 ±0.05
5.60
BALL A1
8.00 ±0.10
4.00 ±0.05
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.35mm ON A
0.30mm SMD BALL PAD.
77X
0.35
SOLDER BALL MATERIAL:
EUTECTIC 62% Sn, 36% Pb, 2% Ag
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
7.20
3.60 ±0.05
5.00 ±0.05
10.00 ±0.10
CL
Table 9:
References
DEVICE
PART NUMBER
LINK
Flash
MT28F644W18/W30
CellularRAM
MT45W2MW16BFB, MT45W2ML16BFB,
MT45M4MW16BFB, MT45W4ML16BFB
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