參數(shù)資料
型號(hào)： MT58L512L18DS-7.5IT
元件分類： SRAM
英文描述： 512K X 18 CACHE SRAM, 4 ns, PQFP100
封裝： PLASTIC, MS-026BHA, TQFP-100
文件頁(yè)數(shù)： 13/31頁(yè)
文件大?。?/td> 613K
代理商： MT58L512L18DS-7.5IT
20
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, Pipelined, DCD SyncBurst SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT58L512L18D_C.p65 – Rev. 6/01
2001, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
TQFP THERMAL RESISTANCE
DESCRIPTION
CONDITIONS
SYMBOL
TYP
UNITS NOTES
Thermal Resistance
Test conditions follow standard test methods
1-layer
θ
JA
40
°C/W
1
(Junction to Ambient)
and procedures for measuring thermal
Thermal Resistance
impedance, per EIA/JESD51.
θ
JC
8
°C/W
1
(Junction to Top of Case)
NOTE: 1. This parameter is sampled.
2. FBGA preliminary package data.
FBGA THERMAL RESISTANCE
DESCRIPTION
CONDITIONS
SYMBOL
TYP
UNITS NOTES
Junction to Ambient
Test conditions follow standard test methods
θ
JA
40
°C/W
2
(Airflow of 1m/s)
and procedures for measuring thermal
Junction to Case (Top)
impedance, per EIA/JESD51.
θ
JC
9
°C/W
2
Junction to Pins
θ
JB
17
°C/W
2
(Bottom)
FBGA CAPACITANCE
DESCRIPTION
CONDITIONS
SYMBOL
TYP
MAX
UNITS
NOTES
Address/Control Input Capacitance
CI
2.5
3.5
pF
2
Output Capacitance (Q)
TA = 25°C; f = 1 MHz
CO
45
pF
2
Clock Capacitance
CCK
2.5
3.5
pF
2
BGA CAPACITANCE
DESCRIPTION
CONDITIONS
SYMBOL
TYP
MAX
UNITS
NOTES
Address/Control Input Capacitance
TA = 25°C; f = 1 MHz
CI
3.5
6
pF
1
Input/Output Capacitance (DQ)
VDD = 3.3V
CO
45
pF
1
Address Capacitance
CA
3.5
6
pF
1
Clock Capacitance
CCK
3.5
4
pF
1
BGA THERMAL RESISTANCE
DESCRIPTION
CONDITIONS
SYMBOL
TYP
UNITS NOTES
Junction to Ambient
Test conditions follow standard test methods
θ
JA
40
°C/W
1
(Airflow of 1m/s)
and procedures for measuring thermal
Junction to Case (Top)
impedance, per EIA/JESD51.
θ
JC
9
°C/W
1
Junction to Bumps
θ
JB
17
°C/W
1
(Bottom)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT58L512L18DT-7.5 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述:
MT58L512L18F 制造商:MICRON 制造商全稱:Micron Technology 功能描述:8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH SYNCBURST SRAM
MT58L512L18FF-10 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述:
MT58L512L18FF-10IT 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述:
MT58L512L18FF-7.5 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述:
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