
MTB75N06HD
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(Cpk ≥ 2.0) (3)
(VGS = 0 Vdc, ID = 250 Adc)
Temperature Coefficient (Positive)
V(BR)DSS
60
—
68
60.4
—
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
—
10
100
Adc
Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 V)
IGSS
—
5.0
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(Cpk ≥ 5.0) (3)
(VDS = VGS, ID = 250 Adc)
Temperature Coefficient (Negative)
VGS(th)
2.0
—
3.0
8.38
4.0
—
Vdc
mV/
°C
Static Drain–Source On–Resistance
(Cpk ≥ 2.0) (3)
(VGS = 10 Vdc, ID = 37.5 Adc)
RDS(on)
—
8.3
10
m
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 75 Adc)
(ID = 37.5 Adc, TJ = 125°C)
VDS(on)
—
0.7
0.53
0.9
0.8
Vdc
Forward Transconductance (VDS = 15 Vdc, ID = 37.5 Adc)
gFS
15
32
—
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
—
2800
3920
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
—
928
1300
Reverse Transfer Capacitance
f = 1.0 MHz)
Crss
—
180
252
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
(VDS = 30 Vdc, ID = 75 Adc,
VGS = 10 Vdc,
RG = 9.1 )
td(on)
—
18
26
ns
Rise Time
(VDS = 30 Vdc, ID = 75 Adc,
VGS = 10 Vdc,
RG = 9.1 )
tr
—
218
306
Turn–Off Delay Time
VGS = 10 Vdc,
RG = 9.1 )
td(off)
—
67
94
Fall Time
G = 9.1 )
tf
—
125
175
Gate Charge
(VDS = 48 Vdc, ID = 75 Adc,
VGS = 10 Vdc)
QT
—
71
100
nC
(VDS = 48 Vdc, ID = 75 Adc,
VGS = 10 Vdc)
Q1
—
16.3
—
(VDS = 48 Vdc, ID = 75 Adc,
VGS = 10 Vdc)
Q2
—
31
—
Q3
—
29.4
—
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 75 Adc, VGS = 0 Vdc)
(IS = 75 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
—
0.97
0.88
1.1
—
Vdc
Reverse Recovery Time
(IS = 75 Adc,
dIS/dt = 100 A/s)
trr
—
56
—
ns
(IS = 75 Adc,
dIS/dt = 100 A/s)
ta
—
44
—
(IS = 75 Adc,
dIS/dt = 100 A/s)
tb
—
12
—
Reverse Recovery Stored Charge
QRR
—
0.103
—
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25
″ from package to center of die)
LD
—
3.5
—
nH
Internal Source Inductance
(Measured from the source lead 0.25
″ from package to source bond pad)
LS
—
7.5
—
nH
(1) Pulse Test: Pulse Width
≤ 300 s, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
(3) Reflects typical values.
Cpk =
Max limit – Typ
3 x SIGMA