NCN7200
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10
PACKAGE DIMENSIONS
WQFN42 3.5x9, 0.5P
CASE 510AP01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
D
E
B
C
0.15
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
K
D2
E2
C
C
0.15
C
0.10
C
0.08
A1
SEATING
PLANE
e
42X
NOTE 3
b
42X
0.10
C
0.05
C
A B
B
DIM
MIN
MAX
MILLIMETERS
A
0.70
0.80
A1
0.00
0.05
b
0.20
0.30
D
3.50 BSC
D2
1.95
2.15
E
9.00 BSC
E2
7.45
7.65
e
0.50 BSC
K
0.20
L
0.30
0.50
22
38
42X
0.50
PITCH
3.80
0.63
9.30
DIMENSIONS: MILLIMETERS
0.35
42X
1
L
A3
0.20 REF
RECOMMENDED
NOTE 4
A3
DETAIL B
2.16
1
PACKAGE
OUTLINE
DETAIL A
e/2
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTION
L1
0.00
0.15
17
MOUNTING FOOTPRINT*
0.10
C A B
0.10
C A B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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