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參數(shù)資料
| 型號(hào)： | NCN7200MTGEVB |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL LAN SWITCH NCN7200 |
| 設(shè)計(jì)資源： | NCN7200MTGEVB Schematic NCN7200MTGEVB BOM NCN7200MTGEVB Gerber Files |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 接口，2:1 多路復(fù)用器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | NCN7200 |
| 主要屬性： | 8 通道 |
| 已供物品： | 板 |
| 其它名稱： | NCN7200MTGEVBOS |
NCN7200
http://onsemi.com
6
GIGABIT ETHERNET LAN SWITCH WITH 2:1 MUX/ DEMUX AND POWER DOWN FEATURE
(Min / Max values are at VDD = 3.3 V ±10%, TA = 40°C to +85°C. Typ values are at VDD = 3.3 V and TA = 25°C)
Symbol
Unit
Max
Typ
Min
Test Conditions
Description
DATA PATH (AX TO BX, CX PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASET ETHERNET SWITCHING
RON
Switch OnResistance (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
2.0
6.0
W
RFLAT(ON)
OnResistance Flatness (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
0.8
DRON
OnResistance match from center
ports to any other port (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
0.8
1.3
ION
On Leakage Current (AX)
VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float
0.1
+0.1
mA
IOFF
Off Leakage Current (AX/BX/CX)
VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or
0 V
0.1
+0.1
mA
DATA PATH (LEDAX TO LEDBX, LEDCX PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASET ETHERNET
SWITCHING
RON
Switch OnResistance (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
7.0
16
W
RFLAT(ON)
OnResistance Flatness (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
0.3
DRON
OnResistance match from center
ports to any other port (Note 3)
VDD = Min, 1.25 V < VIN < VDD, ITN = 10 mA
to 30 mA
0.8
1.25
ION
On Leakage Current (LEDAX)
VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float
0.1
+0.1
mA
IOFF
Off Leakage Current
(LEDAX/LEDBX/LEDCX)
VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or
0 V
0.1
+0.1
mA
CAPACITANCE (AX TO BX, CX AND LEDAX TO LEDBX, LEDCX PINS) (Note 4)
CIN
Input Capacitance
VIN = 0 V, f = 1 MHz
3.0
4.0
pF
COFF(B1,
B2)
Port B Capacitance, Switch OFF
5.0
7.0
CON(A/B)
A/B Capacitance, Switch ON
10.5
12
DYNAMIC ELECTRICAL CHARACTERISTICS (AX TO BX AND LEDAX TO LEDBX PINS) (Note 5)
BW
Bandwidth 3 dB
750
MHz
OIRR
OFF Isolation
30
dB
XTALK
Crosstalk
70
tPD
Propagation Delay (Figure 4)
0.3
ns
tPZH, tPZL
Line Enable Time SEL to AN, BN (Figure 4)
0.5
15
tPHZ, tPLZ
Line Disable Time SEL to AN, BN (Figure 4)
0.5
25
tSK(o)
Output Skew between center port to any other port
0.1
0.2
tSK(p)
Skew between opposite transitions of the same output (tHil, tPLH)
0.1
0.2
2. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic
(cable not connected). Power down current is the minimum power state used when not connected and mobile.
3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower
of the voltages on the two (A & B) pins.
4. Guaranteed by design and/or characterization.
5. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10 pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in
a system is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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