參數(shù)資料
型號: NCP1601BDR2G
廠商: ON Semiconductor
文件頁數(shù): 18/19頁
文件大?。?/td> 257K
描述: IC PFC CTRL CRM/TRANSITION 8SOIC
產(chǎn)品變化通告: NCP1601BDR2G Discontinuation 11/May/2012
標(biāo)準(zhǔn)包裝: 1
模式: 臨界傳導(dǎo)(CRM),間歇式(轉(zhuǎn)換)
頻率 - 開關(guān): 58kHz
電流 - 啟動: 17µA
電源電壓: 9.6 V ~ 18 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 剪切帶 (CT)
其它名稱: NCP1601BDR2GOSCT
NCP1601A, NCP1601B
http://onsemi.com
18
PACKAGE DIMENSIONS
SOIC- -8
D SUFFIX
CASE 751- -07
ISSUE AJ
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1.  DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2.  CONTROLLING DIMENSION: MILLIMETER.
3.  DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4.  MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5.  DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6.  751- -01 THRU 751- -06 ARE OBSOLETE. NEW
STANDARD IS 751- -07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00    0.189
0.197
MILLIMETERS
B
3.80
4.00    0.150
0.157
C
1.35
1.75    0.053
0.069
D
0.33
0.51    0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25    0.004
0.010
J
0.19
0.25    0.007
0.010
K
0.40
1.27    0.016
0.050
M
0
8
0
8
N
0.25
0.50    0.010
0.020
S
5.80
6.20    0.228
0.244
- -X- -
- -Y- -
G
M
Y
M
0.25 (0.010)
- -Z- -
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
r
mm
inches
u
SCALE 6:1
*For additional information on our Pb- -Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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