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參數(shù)資料
| 型號： | NCS5000 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Integrated RF Schottky Detector(集成射頻肖特基探測器) |
| 中文描述： | 集成RF肖特基探測器（集成射頻肖特基探測器） |
| 文件頁數(shù)： | 5/8頁 |
| 文件大小： | 54K |
| 代理商： | NCS5000 |
NCS5000
http://onsemi.com
5
INFORMATION FOR USING THE TSOP–6 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
inches
mm
0.028
0.7
0.074
1.9
0.037
0.95
0.037
0.95
0.094
2.4
0.039
1.0
TSOP–6
TSOP–6 POWER DISSIPATION
The power dissipation of the TSOP–6 is a function of the
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
J(max)
, the maximum rated junction
temperature of the die, R
θ
JA
, the thermal resistance from
the device junction to ambient, and the operating
temperature, T
A
. Using the values provided on the data
sheet for the TSOP–6 package, P
D
can be calculated as
follows:
T
J(max)
– T
A
P
D
=
R
θ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
A
of 25
°
C,
one can calculate the power dissipation of the device which
in this case is 400 milliwatts.
P
D
=150
°
C – 25
°
C
300
°
C/W
The 300
°
C/W for the TSOP–6 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 417
milliwatts.
= 417 milliwatts
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10
°
C.
The soldering temperature and time should not exceed
260
°
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5
°
C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
*Soldering a device without preheating can cause excessive thermal
shock and stress which can result in damage to the device.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NCS5000/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Integrated RF Schottky Detector |
| NCS5000SNT1 | 功能描述:IC DETECTOR RF SCHOTTKY 6TSOP RoHS:否 類別:RF/IF 和 RFID >> RF 檢測器 系列:- 產(chǎn)品變化通告:Product Discontinuation 15/May/2006 標準包裝:3,000 系列:- 頻率:100MHz ~ 2GHz RF 型:手機，GSM，DCS，PCS 輸入范圍:- 精確度:- 電源電壓:2.7 V ~ 5.5 V 電流 - 電源:300µA 包裝:帶卷 (TR) 封裝/外殼:SC-74，SOT-457 其它名稱:NCS5000SNT1GOS |
| NCS5000SNT1G | 功能描述:IC DETECTOR RF SCHOTTKY 6TSOP RoHS:是 類別:RF/IF 和 RFID >> RF 檢測器 系列:- 產(chǎn)品變化通告:Product Discontinuation 15/May/2006 標準包裝:3,000 系列:- 頻率:100MHz ~ 2GHz RF 型:手機，GSM，DCS，PCS 輸入范圍:- 精確度:- 電源電壓:2.7 V ~ 5.5 V 電流 - 電源:300µA 包裝:帶卷 (TR) 封裝/外殼:SC-74，SOT-457 其它名稱:NCS5000SNT1GOS |
| NCS5002/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:50 Ω Matched CMOS RF Power Detector |
| NCS-5010-P | 制造商:Nanaboshi Electric Mfg Co Ltd 功能描述: |
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