參數(shù)資料
型號(hào): NCV33074ADTBR2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 16/26頁(yè)
文件大小: 0K
描述: IC OP AMP SGL SUPP BIPO 14-TSSOP
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 4
轉(zhuǎn)換速率: 13 V/µs
增益帶寬積: 4.5MHz
電流 - 輸入偏壓: 100nA
電壓 - 輸入偏移: 500µV
電流 - 電源: 1.9mA
電流 - 輸出 / 通道: 30mA
電壓 - 電源,單路/雙路(±): 3 V ~ 44 V,±1.5 V ~ 22 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
其它名稱: NCV33074ADTBR2G-ND
NCV33074ADTBR2GOSTR
MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A
http://onsemi.com
23
PACKAGE DIMENSIONS
TSSOP14
CASE 948G
ISSUE B
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
___
_
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
V
14X
REF
K
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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