參數(shù)資料
型號(hào)： P0080SCRP
英文描述： SIDAC|25V V(BO) MAX|800MA I(S)|DO-214AA
中文描述： SIDAC的| 25V的五（公報(bào)）最大| 800mA的我（縣）|的DO - 214AA
文件頁數(shù)： 132/161頁
文件大?。?/td> 986K
代理商： P0080SCRP
Soldering Recommendations
SIDACtor
Data Book
5 - 16
Teccor Electronics
(972) 580-7777
$
Overview
When placing surface mount components, a good solder bond is critical because:
1. The solder provides a thermal path in which heat is dissipated from the
packaged silicon to the rest of the board.
2. A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214 package is to reflow-solder the
device onto a PCB - printed circuit board. (Figure 5-6).
Figure 5-6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with a reliable solution that is easily removed such as Alpha 5003 diluted with
benzyl alcohol. If using a flux, the PCB should be allowed to dry to touch at room
temperature (or in a 70
°
C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder
on the pads begins to flow. This is typically done on a conveyor belt which first
transports the PCB through a pre-heating zone. The pre-heating zone is necessary in
order to reduce thermal shock and prevent damage to the devices being soldered, and
should be limited to a maximum temperature of 165
°
C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone. The vapor zone is obtained by
heating an inactive fluid to its boiling point while using a vapor lock to regulate the
chamber temperature. This temperature is typically 215
°
C, but for temperatures in
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
相關(guān)PDF資料
PDF描述
P0300EA MCU CMOS 44 LD 4MHZ 8K OTP, 0C to +70C, 44-PLCC, TUBE
P0300EARP1 SIDAC|40V V(BO) MAX|800MA I(S)|TO-92VAR
P0300EARP2 MCU CMOS 40 LD 4MHZ 8K OTP, -40C to +125C, 40-PDIP, TUBE
P0300EB MCU CMOS 40 LD 4MHZ 8K OTP, -40C to +85C, 40-PDIP, TUBE
P0300EBRP1 MCU CMOS 44 LD 4MHZ 8K OTP, -40C to +85C, 44-MQFP, TRAY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P0080SD 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:High Surge Current (D-rated) SIDACtor Device
P0080SDL 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:gas plasma arresters-package dimensions/specifications
P0080SDLRP 功能描述:硅對(duì)稱二端開關(guān)元件 HIGH SURGE 6V 1000A RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0080SDRP 功能描述:硅對(duì)稱二端開關(guān)元件 1000A 6V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0080SX 制造商:MERITEK 制造商全稱:MERITEK ELECTRONICS CORPORATION 功能描述:Low Capacitance, Super Low Clamping Voltage Transient Voltage Suppressors
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*