參數(shù)資料
型號: P0080SCRP
英文描述: SIDAC|25V V(BO) MAX|800MA I(S)|DO-214AA
中文描述: SIDAC的| 25V的五(公報)最大| 800mA的我(縣)|的DO - 214AA
文件頁數(shù): 134/161頁
文件大?。?/td> 986K
代理商: P0080SCRP
Soldering Recommendations
SIDACtor
Data Book
5 - 18
Teccor Electronics
(972) 580-7777
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints such that
components can be glued in place. Once the adhesive has cured, the board is pre-
heated and then placed in contact with a molten wave of solder which has a
temperature between 240
°
C - 260
°
C and permanently affixes the component to the
PCB.
Although a popular method of soldering, wave soldering does have some drawbacks:
1. A double pass is often required to remove excess solder.
2. Solder bridging and shadows begin to occur as board density increases.
3. Wave soldering utilizes the sharpest thermal gradient.
Figure 5-9 Wave Soldering Surface Mount Components Only
Figure 5-10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component
Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over
PC board
Wave solder
相關(guān)PDF資料
PDF描述
P0300EA MCU CMOS 44 LD 4MHZ 8K OTP, 0C to +70C, 44-PLCC, TUBE
P0300EARP1 SIDAC|40V V(BO) MAX|800MA I(S)|TO-92VAR
P0300EARP2 MCU CMOS 40 LD 4MHZ 8K OTP, -40C to +125C, 40-PDIP, TUBE
P0300EB MCU CMOS 40 LD 4MHZ 8K OTP, -40C to +85C, 40-PDIP, TUBE
P0300EBRP1 MCU CMOS 44 LD 4MHZ 8K OTP, -40C to +85C, 44-MQFP, TRAY
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