參數(shù)資料
型號: P0300SCRP
英文描述: MCU CMOS 44 LD 20MHZ 8K OTP, -40C to +125C, 44-MQFP, TRAY
中文描述: SIDAC的| 40V的五(公報)最大| 800mA的我(縣)|的DO - 214AA
文件頁數(shù): 134/161頁
文件大?。?/td> 986K
代理商: P0300SCRP
Soldering Recommendations
SIDACtor
Data Book
5 - 18
Teccor Electronics
(972) 580-7777
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints such that
components can be glued in place. Once the adhesive has cured, the board is pre-
heated and then placed in contact with a molten wave of solder which has a
temperature between 240
°
C - 260
°
C and permanently affixes the component to the
PCB.
Although a popular method of soldering, wave soldering does have some drawbacks:
1. A double pass is often required to remove excess solder.
2. Solder bridging and shadows begin to occur as board density increases.
3. Wave soldering utilizes the sharpest thermal gradient.
Figure 5-9 Wave Soldering Surface Mount Components Only
Figure 5-10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component
Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over
PC board
Wave solder
相關PDF資料
PDF描述
P0602ABRP SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0602AC SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0602ACRP SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0640EA SIDAC|77V V(BO) MAX|800MA I(S)|TO-92VAR
P0640EARP1 18LD 4MHZ 1K EPRM/128 EEPROM, 0C to +70C, 18-SOIC 300mil, TUBE
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P0300ZB 功能描述:硅對稱二端開關元件 4Chp 25V 100A RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
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