參數(shù)資料
型號(hào)： P11976EJ2V0AN00
英文描述： uPC2711-15. uPC2745-49. uPC2791/92. uPC3210 6-Pin Mini-Mold. 6-Pin Super Mini-Mold Silicon High-Frequency Wideband Amplifier MMIC
中文描述： uPC2711 - 15。 uPC2745 - 49。 uPC2791/92。 uPC3210 6引腳小型模具。 6引腳超小型模具硅高頻寬帶放大器單片
文件頁(yè)數(shù)： 16/31頁(yè)
文件大?。?/td> 174K
代理商： P11976EJ2V0AN00
Application Note P11976EJ2V0AN00
16
4.
EXTERNAL CIRCUIT COMPONENTS AND APPLICATION CHARACTERISTICS
For a reference, Figure 4-1 illustrates how power gain is viewed based on the output side’s DC cut capacitance
value. As shown in the data sheet, the IC’s operation is a wideband operation and the DC cut capacitor does not
limit the IC’s operation but instead limits the pass band. Accordingly, as a typical example, the following shows how
the high-pass characteristics of the
μ
PC2749T’s DC cut capacitor affects the view of the IC’s bandwidth.
The power gain can be confirmed as being at least 200 MHz when DC cut capacitance value is 10 pF, or at least
100 MHz when the DC cut capacitance value is 200 pF (above 100 MHz, there was no power gain difference
between 1000 pF and 200 pF capacitance). For example, as shown by “2 pF” in the figure, power gain is reduced
completely when the capacitance is small. Consequently, the DC cut capacitor with a value of at least 10 pF should
be selected according to the bandwidth to be used.
Figure 4-1. Power Gain based on Output Side DC Cut Capacitance Value (Example Using
μ
PC2749T)
13.813 dB
12.193 dB
1
1
10 pF
10 pF
10 pF
200 pF
200 pF
2 pF
2 pF
MARKER 1
1.9 GHz
3.0 V
1000 pF
1000 pF
200 pF, 10 pF, 2 pF
PC2749T
μ
0.1
20
18
16
14
12
10
8
6
4
2
0
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8 3.1
Frequency f (GHz)
I
P
Figure 4-2 illustrates the change in power gain that occurs when a bypass capacitor insertion position for the V
CC
line is changed.
Figure 4-2 examines V
CC
pin load characteristics dependent on internal circuit. For typical circuit models,
μ
PC2712T,
μ
PC2745T, and
μ
PC2749T, were selected. In each graph, curve <1> is a result of only the evaluation
PCB’s feed-through capacitor (1000 pF), curve <2> is a result of an additional 1000-pF chip capacitor mounted on
the PCB near feed-through capacitor insertion point, and curve <3> is a result of the 1000-pF chip capacitor moved
close to the IC’s mount position. These measurements are compared to the internal circuit. In other words, for curve
<1>, the load from the feed through capacitor’s leads + the V
CC
pattern (about 7 nH) is connected to the IC’s V
CC
pin.
For curve <2>, the load from only the V
CC
pattern (about 5 nH) is connected to the IC’s V
CC
pin.
In the
μ
PC2712T,
μ
PC2745T, and
μ
PC2747T, the power gain changes less than 1 dB while in the
μ
PC2749T
changes close to 2 dB. This is because, in the
μ
PC2712T and PC2745T circuit which have a resistance or
capacitance inserted to the internal input stage transistor’s emitter side or a multiple negative feedback circuit, the
power gain is determined by the ratio of the emitter-side resistance to the collector-side resistance, so power gain
hardly changes affected by the higher V
CC
pin load impedance. However, in the
μ
PC2749T, because the internal
input stage transistor’s emitter is directly grounded, the transistor’s emitter resistance is itself small, which makes it
easily affected by the V
CC
pin load impedance which is added to the collector-side resistance. In comparison with the
μ
PC2747T, which is considered to have a similar tendency, the
μ
PC2749T has a Darlington output stage, so the
output-stage gain might further amplify the effect of the V
CC
pin’s load impedance.
Therefore, to increase the power gain when actually using the
μ
PC2749T, insert a choke coil (or similar
component) into the V
CC
pin pad and check the characteristics to determine the choke coil’s inductance value.
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