參數(shù)資料
型號(hào)： P12152EJ3V0AN00
英文描述： uPC1678G/1678GV/1679G. uPC2708T to 2710T. uPC2762T/2763T. uPC2771T/2776T Silicon Medium-Power High-Frequency Amplifier MMIC
中文描述： uPC1678G/1678GV/1679G。 uPC2708T到2710T。 uPC2762T/2763T。 uPC2771T/2776T硅中功率高頻單片放大器
文件頁(yè)數(shù)： 14/35頁(yè)
文件大小： 291K
代理商： P12152EJ3V0AN00
Application Note P12152EJ3V0AN00
14
1
C =
2
S
x
Z
x
f
C
When using the IC in the low frequency band, C should be large value, and when using the IC in the high
frequency band, C should be small value to secure the gain.
3.3 Temperature Condition
The maximum ratings of storage and operating temperatures of ICs are regulated in terms of ambient
temperature. The package material is plastic so the thermal conductivity is lower than metal leads, and for this
reason, the thermal resistance is defined by junction to ambient (R
th(j-A)
), rather than case to ambient, which is
meaningless in this case. Because the highly heat conductive metal leads (thermal resistance value between the
junction and the lead is 30
q
C/W or smaller) are the determining factor with regard to thermal conductivity, the
maximum junction temperature T
jMAX
becomes equal to the maximum rating of the storage ambient temperature T
STG
and the maximum ambient temperature T
AMAX
becomes equal to the maximum value of the operating ambient
temperature T
A
(The storage temperature in this section means the non-biased temperature where the case
temperature and ambient temperature are equal.). The relation between the power dissipation P
D
and thermal
resistance is as follows.
T
jMAX
e
T
AMAX
(
q
C)
P
D@
T
AMAX
(W)
R
th
(j-A)
=
The thermal resistance can be calculated since the maximum operating ambient temperature, maximum junction
temperature, and power dissipation (at maximum operating ambient temperature) are defined based on the junction-
to-ambient thermal resistance listed in the individual data sheet of each product.
The
P
PC1678G/GV have a large circuit current so that they experience temperature rise (heat production) due to
IC current loss. This condition can be applied to the above expression. Taking the
P
PC1678G/GV as an example,
the thermal resistance value becomes R
th (j-A)
= 180
q
C/W (when mounting IC on 50
u
50
u
1.6 mm double-sided
epoxy glass copper-clad board). Because the circuit current is 60 mA MAX. when the small signal input at V
CC
= 5.0
V:
Tj = T
A
+ P
D
u
R
th (j-A)
= T
A
+ 5.0 (V)
u
0.060 (A)
u
180 (
q
C/W)
= T
A
+ 54 (
q
C)
Since to Tj
d
150 (
q
C),
T
A
+ 54 (
q
C)
d
150 (
q
C)
T
A
d
96
q
C
Therefore, the operating ambient temperature, T
A
= +85
q
C represents a margin of +11
q
C taking into account IC
heating under these conditions.
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