參數(shù)資料
型號: P1602AC
英文描述: MCU CMOS 18 LD LOW PWR, -40C to +85C, 18-SOIC 300mil, TUBE
中文描述: SIDAC的| 95V V(下公報)最大| 800mA的我(縣)|對220VAR
文件頁數(shù): 133/161頁
文件大?。?/td> 986K
代理商: P1602AC
SIDACtor
Data Book
Soldering Recommendations
Teccor Electronics
(972) 580-7777
5 - 17
T
excess of 215
°
C, care should be taken such that the maximum temperature of the
leads does not exceed 275
°
C and the maximum temperature of the plastic body does
not exceed 250
°
C (Figure 5-8).
Figure 5-7 Principle of Vapor Phase Soldering
Figure 5-8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder will draw the leads of the device
towards the center of the soldering area, correcting any misalignment that may have
occurred during placement and allowing the device to set flush on the pad. However, if
the footprints of the pad are not concentrically aligned, the same effect can result in
undesirable shifts as well, hence the importance of using a standard contact pattern
which leaves sufficient room for self-positioning.
After the solder has cooled, connections should be visually inspected and remnants of
the flux removed using a vapor degreaser with an azeotrope solvent or equivalent.
Transport
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Vapor phase
zone
Vapor lock
(secondary
medium)
Time (Seconds)
0
0
20
40
60
80
100
120
140
160
180
200
220
240
30
60
90
120
150
180
210
240
270
300
T
C
Pre-Heat
Soak
Reflow
Cool
Down
0.5 - 0.6
C/Sec
1.3 - 1.6
C/Sec
<2.5
C/Sec
<2.5
C/Sec
Peak Temp.
210 - 235
C
Soaking Zone
Reflow Zone
Pre-heating Zone
( 2.0 - 4.0 min. max. )
( 2.0 min. max. )
60 - 90 sec. typical
( 2.0 min. max. )
30 - 60 sec. typical
相關PDF資料
PDF描述
P1602ACRP MCU CMOS 18 LD LOW PWR, 0C to +70C, 18-SOIC 300mil, T/R
P1800SARP SIDAC|220V V(BO) MAX|800MA I(S)|DO-214AA
P1800SBRP SIDAC|220V V(BO) MAX|800MA I(S)|DO-214AA
P1800SCRP SIDAC|220V V(BO) MAX|800MA I(S)|DO-214AA
P1803AA SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
相關代理商/技術(shù)參數(shù)
參數(shù)描述
P1602AC MCL 功能描述:硅對稱二端開關元件 Modified TO-220 Two-Chip MicroCapacitance (MC) SIDACtor Device RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1602AC60 功能描述:硅對稱二端開關元件 500A 65/130V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1602ACL 功能描述:硅對稱二端開關元件 65/130V 500A TO220A SIDACtor SYM 2Chp RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1602ACL60 功能描述:硅對稱二端開關元件 500A 65/130V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1602ACLRP 功能描述:硅對稱二端開關元件 500A 65/130V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流(在 VDRM IDRM 下): 保持電流(Ih 最大值):50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA