參數(shù)資料
型號(hào)： P83C366BDA
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： Microcontrollers for PAL/SECAM TV with OSD and VST(帶 OSD和 VST的在PAL/SECAM TV中應(yīng)用的微控制器)
中文描述： 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQCC68
封裝： PLASTIC, MO-047AC, SOT-188-2, LCC-68
文件頁(yè)數(shù)： 77/80頁(yè)
文件大?。?/td> 266K
代理商： P83C366BDA
1999 Jun 11
77
Philips Semiconductors
Product specification
Microcontrollers for NTSC TVs with On-Screen
Display (OSD) and Closed Caption (CC)
P8xCx70 family
27 SOLDERING
27.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
27.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
27.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
27.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P83C366BDR 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Microcontrollers for PAL/SECAM TV with OSD and VST
P83C366CBP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Microcontrollers for PAL/SECAM TV with OSD and VST
P83C370 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Microcontrollers for NTSC TVs with On-Screen Display OSD and Closed Caption CC
P83C370AAR 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Microcontrollers for NTSC TVs with On-Screen Display OSD and Closed Caption CC
P83C380 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Microcontrollers for monitors with DDC interface, auto-sync detection and sync proc.
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