參數(shù)資料
型號： P87C770
廠商： NXP Semiconductors N.V.
英文描述： Microcontrollers for NTSC TVs with On-Screen Display (OSD) and Closed Caption (CC)(在NTSC TV中應(yīng)用的具有屏幕顯示和字幕關(guān)閉特點(diǎn)的微控制器)
中文描述： 微控制器用于NTSC電視的屏幕顯示（OSD）和字幕（CC）的（在NTSC電視中應(yīng)用的具有屏幕顯示和字幕關(guān)閉特點(diǎn)的微控制器）
文件頁數(shù)： 77/80頁
文件大?。?/td> 266K
代理商： P87C770
1999 Jun 11
77
Philips Semiconductors
Product specification
Microcontrollers for NTSC TVs with On-Screen
Display (OSD) and Closed Caption (CC)
P8xCx70 family
27 SOLDERING
27.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
27.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
27.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
27.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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