參數(shù)資料
型號: PC7447VGH1200L
廠商: Atmel Corp.
英文描述: PowerPC 7457 RISC Microprocessor
中文描述: 7457的PowerPC RISC微處理器
文件頁數(shù): 44/66頁
文件大小: 522K
代理商: PC7447VGH1200L
44
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Substrate Capacitors for the PC7447, 360 CBGA
Figure 26 shows the connectivity of the substrate capacitor pads for the PC7447, 360 CBGA. All capacitors are 100 nF.
Figure 26.
Substrate Bypass Capacitors for the PC7447, 360 CBGA
Package Parameters for
the PC7457, 483 CBGA
The package parameters are as provided in the following list. The package type is
29
×
29 mm, 483-lead ceramic ball grid array (CBGA).
Package outline
29 mm × 29 mm
Interconnects
483 (22 × 22 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
Maximum module height
3.22 mm
Ball diameter
0.89 mm (35 mil)
1
C1-2
C1-1
C2-1
C3-1
C4-1
C5-1
C6-1
C6-2
C5-2
C4-2
C3-2
C2-2
C18-1
C18-2
C17-2 C16-2
C15-2
C14-2
C13-2
C13-1
C14-1
C15-1
C16-1
C17-1
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
A1 CORNER
C1
GND
VDD
VDD
OVDD
VDD
VDD
VDD
VDD
VDD
OVDD
VDD
VDD
VDD
VDD
VDD
VDD
OVDD
VDD
OVDD
VDD
VDD
OVDD
VDD
VDD
VDD
C2
GND
C3
GND
C4
GND
C5
GND
C6
GND
C7
GND
C8
GND
C9
GND
C10
GND
C11
GND
C12
GND
C13
GND
C14
GND
C15
GND
C16
GND
C17
GND
C18
GND
C19
GND
C20
GND
C21
GND
C22
GND
C23
GND
C24
GND
Capacitor
Pad Number
-1
-2
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