參數(shù)資料
型號(hào)： PC745BMZFU300LD
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 255PIN |塑料
文件頁(yè)數(shù)： 20/48頁(yè)
文件大?。?/td> 276K
代理商： PC745BMZFU300LD
20/48
PC755B/745B
3.4.3. Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (BGA) package for air-cooled applications.
Proper thermal control design is primarily dependent upon the system-level design-the heat sink, airflow and thermal interface mate-
rial. To reduce the die-junction temperature, heat sinks may be attached to the package by several methods–adhesive, spring clip to
holes in the printed-circuit board or package, and mounting clip and screw assembly; see Figure 7. This spring force should not
exceed 5.5 pounds of force.
Adhesive
or
Thermal Interface Material
Heat Sink
Heat Sink
Clip
Printed–Circuit Board
Option
BGA Package
Figure 7 : Package Exploded Cross-Sectional View with Several Heat Sink Options
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air veloc-
ity, spatial volume, mass, attachment method, assembly, and cost.
3.4.3.1. Adhesives and Thermal Interface Materials
0
0.5
1
1.5
2
0
10
20
30
Contact Pressure (psi)
40
50
60
70
80
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
S
Figure 8 : Thermal Performance of Select Thermal Interface Material
相關(guān)PDF資料
PDF描述
PC755BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC745BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC745BMZFU350LD 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVGH300LE 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 300MHZ 2.5V/3.3V 255HITCE CBGA - Trays
PC745BVGH350LE 制造商:e2v technologies 功能描述:PC745BVGH350LE - Trays
PC745BVZFU300LD 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*