參數(shù)資料
型號(hào): PC755BVZFU400LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料
文件頁(yè)數(shù): 38/48頁(yè)
文件大小: 276K
代理商: PC755BVZFU400LD
38/48
PC755B/745B
7. PACKAGE MECHANICAL DATA
The following sections provide the package parameters and mechanical dimensions for the PC745B, 255 PBGA package as well as
the PC755B, 360 CBGA and PBGA packages. While both the PC755B plastic and the ceramic packages are described here, both
packages are not guaranteed to be available at the same time. All new designs should allow for either ceramic or plastic BGA pack-
ages for this device. For more information on designing a common footprint for both plastic and ceramic package types, please con-
tact your local Motorola sales office.
7.1. Parameters for the PC745B
7.1.1. Package Parameters for the PC745B PBGA
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead plastic ball grid
array (PBGA)
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
Maximum module height
2.80 mm
Ball diameter (typical)
0.75 mm (29.5 mil)
相關(guān)PDF資料
PDF描述
PC745BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC755CMGHU300LE 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor
PC755CMGHU366LE 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor
PC755CMGHU400LE 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor
PC755CMGSU300LE 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor