參數(shù)資料
型號(hào): PC755CMGSU350LE
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: PowerPC 755/745 RISC Microprocessor
中文描述: 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝: SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁(yè)數(shù): 40/50頁(yè)
文件大?。?/td> 1064K
代理商: PC755CMGSU350LE
40
PC755/745
2138D–HIREL–06/03
Mechanical Dimensions of the
PC755 CBGA Package
Figure 28 provides the mechanical dimensions and bottom surface nomenclature of the
PC755, 360 CBGA package.
Figure 27.
Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (CBGA)
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
B
C
C
360X
e
1 2 3 4 5 6 7 8 9 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
A
A1
A2
C
C
171819
U
W
V
Millimeters
DIM
Min
Max
A
2.65
3.20
A1
0.79
0.99
A2
1.10
1.30
A3
0.60
b
0.82
0.93
D
25.00 BSC
D1
6.75
E
25.00 BSC
E1
7.87
e
1.27 BSC
0.2
D
2X
A1 CORNER
E
0.2
2X
A
E1
D1
A3
1
0.15
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參數(shù)描述
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