參數(shù)資料
型號: PC755CMGSU350LE
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: PowerPC 755/745 RISC Microprocessor
中文描述: 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝: SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁數(shù): 42/50頁
文件大?。?/td> 1064K
代理商: PC755CMGSU350LE
42
PC755/745
2138D–HIREL–06/03
Mechanical Dimensions of the
PC755 CI-CGA Package
Figure 29 provides the mechanical dimensions and bottom surface nomenclature of
PC755, 360 CI-CGA package
Figure 29.
Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (CI-CGA)
Clock Relationship
Choices
The PC755’s PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK
(bus) frequency, the PLL configuration signals set the internal CPU and VCO frequency
of operation. The PLL configuration for the PC755 is shown in Figure 31 for example
frequencies.
B
C
C
360X
e
1 2 3 4 5 6 7 8 9 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
A
A4
A2
171819
U
W
V
Millimeters
DIM
Min
Max
A
4.04 BSC
A1
A2
1.10
1.30
1.545
1.695
A3
0.60
b
0.79
0.990
D
25.00 BSC
D1
6.75
E
25.00 BSC
E1
7.87
e
0.2
D
2X
A1 CORNER
E
0.2
2X
A
E1
D1
A3
A1
A6
A5
A4
0.82
0.9
A5
0.10 BSC
A6
0.25
0.35
1.27 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
360 X
A
0.15
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