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參數(shù)資料
| 型號： | PC755CMGU400LE |
| 廠商： | ATMEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | PowerPC 755/745 RISC Microprocessor |
| 中文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | CERAMIC, BGA-360 |
| 文件頁數(shù)： | 20/50頁 |
| 文件大小： | 1064K |
| 代理商： | PC755CMGU400LE |
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20
PC755/745
2138D–HIREL–06/03
Adhesives and Thermal
Interface Materials
Figure 8.
Thermal Performance of Select Thermal Interface Material
A thermal interface material is recommended at the package lid-to-heat sink interface to
minimize the thermal contact resistance. For those applications where the heat sink is
attached by spring clip mechanism, Figure 8 shows the thermal performance of three
thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint,
and a joint with thermal grease as a function of contact pressure. As shown, the perfor-
mance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately 7 times greater than the ther-
mal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-
circuit board (see Figure 7). This spring force should not exceed 5.5 pounds of force.
Therefore, the synthetic grease offers the best thermal performance, considering the
low interface pressure.
The board designer can choose between several types of thermal interface. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as
follows:
T
j
= T
a
+ T
r
+ (
θ
jc
+
θ
int
+
θ
sa
) * P
d
Where
:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
0
0.5
1
1.5
2
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
S
0
10
20
30
40
50
60
70
80
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| PC755CMZFU350LE | PowerPC 755/745 RISC Microprocessor |
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| PC755CMZFU366LE | PowerPC 755/745 RISC Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC755CMZFU300LE | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor |
| PC755CMZFU350LE | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor |
| PC755CMZFU366LE | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor |
| PC755CMZFU400LE | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 755/745 RISC Microprocessor |
| PC755CVGH400LE | 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 400MHZ, 2.0V, HITCE, IND TEMP 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 400MHZ 2.5V/3.3V 360HITCE CBGA - Trays |
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