參數(shù)資料
型號: PCA9530DP
廠商: NXP Semiconductors N.V.
元件分類: LED驅(qū)動器
英文描述: 2-bit I2C-bus LED dimmer
封裝: PCA9530D<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2005,;PCA9530D<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2005,;
文件頁數(shù): 11/24頁
文件大?。?/td> 143K
代理商: PCA9530DP
PCA9530_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 26 February 2009
19 of 24
NXP Semiconductors
PCA9530
2-bit I2C-bus LED dimmer
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in
JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
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相關代理商/技術參數(shù)
參數(shù)描述
PCA9530DP,118 功能描述:LED照明驅(qū)動器 I2C LED DIMMER 2BIT RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:SO-16N
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PCA9531BS,118 功能描述:LED照明驅(qū)動器 8-BIT I2C FM OD LED RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:SO-16N