參數(shù)資料
型號: PCA9552PW
廠商: NXP Semiconductors N.V.
元件分類: LED驅動器
英文描述: 16-bit I2C-bus LED driver with programmable blink rates
封裝: PCA9552BS<SOT616-1 (HVQFN24)|<<http://www.nxp.com/packages/SOT616-1.html<1<Always Pb-free,;PCA9552D<SOT137-1 (SO24)|<<http://www.nxp.com/packages/SOT137-1.html<1<we
文件頁數(shù): 16/28頁
文件大?。?/td> 159K
代理商: PCA9552PW
PCA9552_5
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
23 of 28
Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
15.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215
°Cto270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness
≥ 2.5 mm
for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
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